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Development Services×TPTジャパン - List of Manufacturers, Suppliers, Companies and Products

Development Services Product List

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Tabletop Wire Bonder "Full Manual HB05"

Tabletop Wire Bonder "Full Manual HB05"

Profiles can store up to 20 programs! Suitable for simple wiring tasks.

The "Full Manual HB05" is a full manual type tabletop wedge-ball combined wire bonder that prioritizes cost above all else. It features a liquid crystal display, with the bond profile shown digitally, and can store up to 20 programs in memory. Additionally, the wire feed function and movable clamp make wire handling tasks easy. 【Features】 ■ Focused on price with minimal functions ■ Suitable for simple wiring tasks ■ Ideal for prototype development with both wedge bond and ball bond capabilities ■ Excellent cost performance ■ Easy operation with liquid crystal display and wire feed function *For more details, please refer to the PDF materials or feel free to contact us.

  • Other processing machines

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Tabletop wire bonder "Thick wire semi-auto HB30"

Tabletop wire bonder "Thick wire semi-auto HB30"

This is a thick line wedge bonder that can be utilized in prototype development scenes with its light footwork and excellent operability.

The "Thick Wire Semi-Auto HB30" is a newly added compact and low-cost desktop prototype machine specifically designed for thick wire, featuring excellent operability for power modules. It is ideal for the prototype development and small-scale production of thick wires. Its features include automatic height setting, loop profile functionality, profile modification and saving via touch panel operation, and the agility characteristic of a desktop machine. 【Features】 ■ Dedicated to thick wire ■ Compact ■ Low-cost ■ Excellent operability ■ Suitable for prototype development and small-scale production of thick wires *For more details, please refer to the PDF document or feel free to contact us.

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Tabletop Wire Bonder HB16

Tabletop Wire Bonder HB16

Tabletop Wire Bonder HB16

The TPT company's tabletop wire bonder is an ideal tabletop wire bonder for prototype development and rework, capable of wedge (ribbon) and ball bond (bump) with just a tool change. With the loop profile function controlled by Y and Z axis motors, it enables high-precision bonding in loop shapes such as reverse and low loops. Additionally, the wire feed function significantly reduces wire handling tasks, and the adoption of a touch panel allows for efficient profile editing. Other options include the manual type HB10 series (Z axis motor control) and the fully manual HB05 series.

  • Bonding Equipment

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Tabletop Wire Bonder "Manual HB10"

Tabletop Wire Bonder "Manual HB10"

Ideal for prototype development! Recommended for simple applications such as test wiring and small-scale bonding.

The "Manual HB10" is a manual-type tabletop wedge-ball hybrid wire bonder that retains the excellent features of the "HB16" while considering price aspects. The Z-axis is motor-controlled, allowing for consistent control of loop height. The user interface features a 6.5-inch touch panel, enabling smooth changes and saving/loading of parameters. Additionally, the work surface is equipped with a sliding clamp and wire feed function, significantly reducing wire handling tasks and providing excellent operability. 【Features】 ■ Suitable for prototype development with both wedge bond and ball bond capabilities ■ Z-axis control for loop height management ■ Excellent operability with touch panel and wire feed function ■ Comprehensive features and stable bonding ■ Significant reduction in wire handling tasks *For more details, please refer to the PDF document or feel free to contact us.

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